Long Term Operating Temperature: -250 °C / +150 °C
Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive.
Carbonaut is available pre-assembled in many standard CPU / GPU sizes.
Size - CPU/GPU
32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K
38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X
51 x...
Long Term Operating Temperature: -100 °C to +250 °C
Features: Description: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity.
Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is
Long Term Operating Temperature: -250 °C / +150 °C
Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive.
Carbonaut is available pre-assembled in many standard CPU / GPU sizes.
Size - CPU/GPU
32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K
38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X
51 x...
Memory Standard: 4 x DIMM slots, max. 192GB, DDR5
Support up to 8800+MT/s (OC), Non-ECC, Un-buffered, Clocked Unbuffered DIMM (CUDIMM)*
Dual channel memory architecture
Supports Intel® Extreme Memory Profile (XMP) memory module
Supports DIMM Flex
NitroPath DRAM Technology
DIMM FIT
ASUS Enhanced Memory Profile III (AEMP III)
* Supported memory types, data rate (speed), and number of DRAM modules vary depending on the CPU and memory configuration, for more information please refer to CPU/Memory Support list under the Support tab of product information site or visit https://www.asus.com/support/ download-center/.
* Non-ECC, un-buffered DDR5 memory supports On-Die ECC function.
Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.