Components & Storage

(37)

• CAS Latency: CL13
• Voltage: 1.20V
• Timing: 13-15-15-28
• Buffered/Registered: Unbuffered
• Model #: CMK32GX4M2A2133C13

OUT OF STOCK

• Brand: SAMSUNG
• Capacity: 16GB
• Speed: DDR5 6400 (PC5 51200)
• Buffered/Registered: Registered
• Model #: M321R2GA3EB2-CCP

(1)

OUT OF STOCK

• Brand: MSI
• CPU Socket Type: (1) AMD Socket AM5
• CPU Type: Single AMD Ryzen 7000 Series Processor, up to TDP 170W
• Number of Processor Support: 1
• Model #: 919-S3361-002

(18)

• Memory Standard: Up to DDR5 8600+ MT/s (OC)
• Number of Memory Slots: 4x288pin (DDR5)
• Audio Chipset: Realtek ALC897
• Brand: MSI
• Model #: B860 GAMING PLUS WIFI

• Memory Standard: 4 x DIMM slots, max. 192GB, DDR5 Supports up to 8400+MT/s (OC), Non-ECC,Un-buffered ,Clocked Unbuffered DIMM (CUDIMM)* Dual channel memory architecture DIMM Fit Supports Intel® Extreme Memory Profile (XMP) memory module ASUS Enhanced Memory Profile III(AEMPIII) * Supported memory types, data rate (speed), and number of DRAM modules vary depending on the CPU and memory configuration, for more information please refer to CPU/Memory Support list under the Support tab of product information site or visit https://www.asus.com/support/ download-center/. * Non-ECC, un-buffered DDR5 memory supports On-Die ECC function.
• Number of Memory Slots: 4x288pin (DDR5)
• Brand: ASUS
• CPU Socket Type: LGA 1851
• Model #: PRIME B860M-A WIFI-CSM

• Model #: LJX-PCI-0297

• CAS Latency: CL15
• Timing: 15-15-15-36
• Voltage: 1.20V
• Buffered/Registered: Unbuffered
• Model #: PSD48G213381S

• Type: 240-Pin DDR3 SDRAM
• Rank: 2Rx4
• Model #: BD8GX21866MTR23

(45)

• CAS Latency: CL16
• Voltage: 1.20V
• Timing: 16-18-18-35
• Recommend Use: High Performance or Gaming Memory / Intel 100 Series / Intel 200 Series / Intel 300 Series / Intel 400 Series / Intel X299
• Model #: CMK16GX4M2A2666C16R

OUT OF STOCK

• Type: 288-Pin DDR4 SDRAM
• Rank: 2Rx4
• Model #: BD8G2666MQR26

(19)

• Memory Standard: DDR3 1066/1333
• Number of Memory Slots: 2x240pin
• Audio Chipset: VIA VT1708S
• Brand: MSI
• Model #: H61M-P21 (B3)

• Max Sequential Read: Up to 520 MBps
• Max Sequential Write: Up to 480 MBps
• 4KB Random Read: Up to 96,000 IOPS
• Controller: SMI SM2258
• Model #: PX-256S2G

• Model #: SP016GBLFU240X02

• Max Sequential Read: 1.76 GB/s
• Max Sequential Write: 1.76 GB/s
• Controller: Intel
• Sustained Sequential Read: 1.76 GB/s
• Model #: SSDPEKNW020T8XT

• Chipset: Samsung Chipset
• CAS Latency: CL19
• Voltage: 1.20V
• Rank: 4DRx4 (4Rx4)
• Model #: MEM-DR464LE-LR26 M386A8K40BM2-CTD

• Model #: PB00GTDTGES

• Model #: ZXL-00477

• CAS Latency: CL13
• Timing: 13-13-13-32
• Voltage: 1.50V
• Type: 240-Pin DDR3 SDRAM
• Model #: 992136

• Average Latency: 6Gb/s
• Model #: 861691-B21

• Chipset: Major OEM Samsung, Micron, Hynix
• CAS Latency: CL19
• Voltage: 1.20V
• Part Number: MR21300-324K1B
• Model #: 0759170858873

• CAS Latency: CL9
• Timing: 9-9-9-24
• Voltage: 1.50V
• Buffered/Registered: Unbuffered
• Model #: 991646

• Chipset: Major OEM Samsung, Micron, Hynix
• CAS Latency: CL15
• Voltage: 1.20V
• Part Number: ML17000-344K1
• Model #: ML17000-344K01-372

• Chipset: Major OEM Samsung, Micron, Hynix
• CAS Latency: CL19
• Voltage: 1.20V
• Part Number: ML21300-944K1
• Model #: ML21300-944K01-524

• Model #: ZXL-00472

• Model #: 662078-L21

• Model #: MEM-DR464L-SL03-LR26

• Chipset: Major OEM Samsung, Micron, Hynix
• CAS Latency: CL19
• Voltage: 1.20V
• Part Number: MR21300-628K1
• Model #: 98-693-410

• Chipset: Samsung Chipset
• CAS Latency: CL17
• Voltage: 1.20V
• Rank: 4Rx4
• Model #: MEM-DR464L-SL01-LR24

• Model #: R0Q86B

• Chipset: Major OEM Samsung, Micron, Hynix
• CAS Latency: CL19
• Voltage: 1.20V
• Part Number: MSE21300-628K1
• Model #: MSE21300-628K01-427

• Model #: PA41

• Chipset: Samsung Chipset
• CAS Latency: CL19
• Voltage: 1.20V
• Rank: 4Rx4
• Model #: MEM-DR464LE-LR26 M386A8K40CM2-CTD

• Model #: DW-TXB005

• Model #: 9541-2IR

• Model #: XICPE3162-4I