Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, and the viscosity is optimized to
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Memory Standard: Memory Support 7800+(OC)/ 7600(OC)/ 7400(OC)/ 7200(OC)/ 7000(OC)/ 6800(OC)/ 6600(OC)/ 6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600(JEDEC)/ 5400(JEDEC)/ 5200(JEDEC)/ 5000(JEDEC)/ 4800(JEDEC) MHz
Max. overclocking frequency:
• 1DPC 1R Max speed up to 7800+ MHz
• 1DPC 2R Max speed up to 6600+ MHz
• 2DPC 1R Max speed up to 6400+ MHz
• 2DPC 2R Max speed up to 5600+ MHz
Number of Memory Slots: 4x DDR5 UDIMM, Maximum Memory Capacity 256GB
PCI Express x16: 2x PCI-E x16 slot
1x PCI-E x1 slot
PCI_E1 Gen PCIe 5.0 supports up to x16 (From CPU)
PCI_E2 Gen PCIe 3.0 supports up to x1 (From Chipset)
PCI_E3 Gen PCIe 4.0 supports up to x4 (From Chipset)