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Thermal Grizzly TG-A-030-R Aeronaut - 7.8 g / 3 ml
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Thermal Grizzly TG-A-030-R Aeronaut - 7.8 g / 3 ml
  • Volume / Net Weight: 0.01 lb
  • Long Term Operating Temperature: -150 ° C / +200 ° C
  • Model #: TG-A-030-R 7.8g
Thermal Grizzly Aeronaut 8.5 W/M K 1G Heat Sink Compound Heat Sink Compounds (1
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5pcs/lot Aluminum Heatsink14x14x6mm with 3M 8810 Thermally Conductive Adhesive Tapes Electronic Chip Cooling Radiator Cooler
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5pcs/lot Aluminum Heatsink14x14x6mm with 3M 8810 Thermally Conductive Adhesive Tapes Electronic Chip Cooling Radiator Cooler

Limited time offer, ends 06/30

  • Color: Silver
  • Compatibility: Motherboard Chipsets
  • Features: 5 pcs of 14x14x6mm aluminum heat sinks with 3M 8810 Heat transfer Peel and Stick Tape Widely use for 3D Printer A4988 chipset,computer PC chipset, power IC, power electric device, LED light devices,Raspberry Pi,Banan Pi, Orange Pi,etc. Come with 3M 8810, is a tacky pressure sensitive adhesive loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates. Only pressure is needed to form an excellent bond and thermal interface. The specialized chemistry of 3M 8810 renders the tape modestly soft and able to wet to many surfaces, allowing it to conform well to non-flat substrates, provide high adhesion, and act as a good thermal interface Excellent adhesive performance with good wetting and flow onto many substrate surfaces. Th...
  • Model #: 11-001-395
  •  
  • $9.49 
  • Free Shipping
Direct from EN-Labs Direct from EN-Labs
  • $4.82 - $9.49
Gelid Solutions GC-4-3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive
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Gelid Solutions GC-4-3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive
  • Volume / Net Weight: 3.5g
  • Long Term Operating Temperature: -30~150
  • Features: GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.
  • Model #: GC-4-3.5g
UPSIREN OEM Thermal Pad 21W/mk Size 100x100mm Non Conductive Heat Resistance High Temperature Resistance Silicone Thermal Pads for Laptop Heatsink/GPU/CPU/LED Cooler 100*100*2.5mm
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UPSIREN OEM Thermal Pad 21W/mk Size 100x100mm Non Conductive Heat Resistance High Temperature Resistance Silicone Thermal Pads for Laptop Heatsink/GPU/CPU/LED Cooler 100*100*2.5mm
  • Volume / Net Weight: 23g
  • Thermal Conductivity: 21W/mk
  • Long Term Operating Temperature: -40 to 200 C
  • Model #: OEM-21W100X25MM
  •  
  • $21.59 
  • Free Shipping
Available Direct from UPSIREN Available Direct from UPSIREN
10pcs/lot Aluminum Heatsink 8.8x8.8x5mm with 3M 8810 Thermally Conductive Adhesive Tapes Electronic Chip Cooling Radiator Cooler
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10pcs/lot Aluminum Heatsink 8.8x8.8x5mm with 3M 8810 Thermally Conductive Adhesive Tapes Electronic Chip Cooling Radiator Cooler

Limited time offer, ends 06/30

  • Color: Silver
  • Compatibility: Motherboard Chipsets
  • Features: 10 pcs of 8.8x8.8x5mm aluminum heat sinks with 3M 8810 Heat transfer Peel and Stick Tape Widely use for 3D Printer A4988 chipset,computer PC chipset, power IC, power electric device, LED light devices,Raspberry Pi,Banan Pi, Orange Pi,etc. Come with 3M 8810, is a tacky pressure sensitive adhesive loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates. Only pressure is needed to form an excellent bond and thermal interface. The specialized chemistry of 3M 8810 renders the tape modestly soft and able to wet to many surfaces, allowing it to conform well to non-flat substrates, provide high adhesion, and act as a good thermal interface Excellent adhesive performance with good wetting and flow onto many substrate surfaces....
  • Model #: 11-001-393
  •  
  • $9.89 
  • Free Shipping
Direct from EN-Labs Direct from EN-Labs
  • $4.75 - $9.89