Fans & PC Cooling

• Volume / Net Weight: 4.0g
• Thermal Conductivity: 8.5 W/mK
• Specifications: Thermal Conductivity (W/mk): 8.5 Viscosity (poise): 870 Density (g/cm3): 2.5 Net Weight: 4g The ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU / GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer. The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low thermal resistance. These characteristics effectively dissipate the emitted heat from the core components. The consistency of the ARCTIC MX-4 is designed for simple application. Its text...
• Model #: ACTCP00002B

• Thermal Conductivity: 14.2 W/mK
• Long Term Operating Temperature: -250 °C / +350 °C
• Model #: TG-KE-002 R

(634)

• Volume / Net Weight: 3.5g
• Thermal Conductivity: 3.8 W/mK
• Specifications: CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds. Net Weight: 3g Thermal Conductivity: 3.8 W/mK Thermal Impedance: 0.01°C -in2/W Viscosity: 2300K cPs Specific Gravity: 2.5g/cm3
• Model #: CT-9010001-WW

• Specifications: Thermal Conductivity (W/mk): 8.5Viscosity (poise): 870Density (g/cm3): 2.5Net Weight: 8gThe ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU / GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer.The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low thermal resistance. These characteristics effectively dissipate the emitted heat from the core components.The consistency of the ARCTIC MX-4 is designed for simple application. Its texture is just thin enough to spread onto components using fingers without creating much mess....
• Model #: ACTCP00008A

Limited time offer, ends 01/25

• Specifications: Thermal Conductivity (W/mk): 8.5Viscosity (poise): 870Density (g/cm3): 2.5Dimensions: 20g: 182 x 35 x 20 mmNet Weight: 20g
• Model #: ARCTIC MX-4 (2g)-B

Limited time offer, ends 01/25

• Specifications: Thermal Conductivity (W/mk): 8.5 Viscosity (poise): 870 Density (g/cm3): 2.5 Dimensions: 20g: 182 x 35 x 20 mm Net Weight: 20g
• Option: N/A
• Model #: ARCTIC MX-4 (2g)

• Thermal Conductivity: 8.0 W/mK
• Long Term Operating Temperature: -100 °C to +250 °C
• Model #: TG-MP8-30-30-05 1R

• Thermal Conductivity: 8.0 W/mK
• Long Term Operating Temperature: -100 °C to +250 °C
• Model #: TG-MP8-100-100-15 1R

• Thermal Conductivity: 8.0 W/mK
• Long Term Operating Temperature: -100 °C to +250 °C
• Features: Description: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity. Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is
• Model #: TG-MP8-120-20-05 2R

• Thermal Conductivity: 62,5 W/mk
• Long Term Operating Temperature: -250 °C / +150 °C
• Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive. Carbonaut is available pre-assembled in many standard CPU / GPU sizes. Size - CPU/GPU 32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K 38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X 51 x...
• Model #: TG-CA-31-25-02-R

Limited time offer, ends 01/25

• Volume / Net Weight: 2.0g
• Thermal Conductivity: 8.5 W/mK
• Specifications: 8.5W/(mK) Thermal Conductivity. 870 Poise Viscosity. 2.5g/cm³ Density. 3.8 x 10¹³ O-cm Volume Resistivity.
• Model #: ACTCP00007B

Limited time offer, ends 01/25

• Series: TF7
• Volume / Net Weight: 2.0g
• Thermal Conductivity: 12.8W/mk
• Long Term Operating Temperature: -150/ +250 C
• Model #: TF7-2g

• Thermal Conductivity: 62,5 W/mk
• Long Term Operating Temperature: -250 °C / +150 °C
• Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive. Carbonaut is available pre-assembled in many standard CPU / GPU sizes. Size - CPU/GPU 32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K 38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X 51 x...
• Model #: TG-CA-38-38-02-R

• Volume / Net Weight: 1.5g
• Thermal Conductivity: 130 W/mk
• Long Term Operating Temperature: 8 to 140
• Model #: LM101

• Volume / Net Weight: 20g
• Thermal Conductivity: 1.06 W/mK
• Specifications: Color: White Bleed: <0.05% at 200°C/24 hours Evaporation: <0.001% at 200°C/24 hours Materials: Silicone Compounds 50% Carbon Compounds 20% Metal Oxide Compounds 30% Thermal Resistance: <0.195°C-m2/W Thermal Conductivity: >1.066 W/(m·K)
• Parts: 2 Year
• Model #: HEATGREASE20

off w/ promo code MKTC7GSPFNTP,limited offer

• Part Number: AGT-GT102G-GL
• Thermal Conductivity: 13.6 W/mK
• Long Term Operating Temperature: -50 to 250 C
• Model #: AGT-GT102G-GL

• Volume / Net Weight: 1.5g
• Thermal Conductivity: 1.93 W/mK
• Specifications: Bleed < 0.05% at 150 Degree C/24 Hours Evaporation < 0.001% at 150 Degree C/24 Hours Specific Gravity > 1.7 at Degree C Thermal Conductivity > 1.93 W/m-K at 25 Degree C Thermal Resistance < 0.120 Degree C-in2/W at 25 Degree C Operating Temperature: -30 to 180 Degree C (-22 to 356 Degree F) Color: Silver Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20% Product Length: 2.6 in [67 mm] Product Weight: 0.4 oz [10 g] Product Width: 0.8 in [20 mm] Included in Package: 1 x 1.5g Tube of Silver Based Thermal Grease
• Model #: SILVGREASE1

• Model #: 9391048866163

• Model #: 652843972923

• Model #: 694782996004

• Model #: 9435761107346

• Volume / Net Weight: 50.0g
• Thermal Conductivity: 12 W/mk
• Long Term Operating Temperature: -50 to 240 C
• Specifications: Low Therm,al Resistance
• Model #: TH-201250

• Model #: 9359014220647

• Volume / Net Weight: 1.0g
• Thermal Conductivity: 73 W/mK
• Long Term Operating Temperature: 10 °C / +140 °C
• Features: Thermal Conductivity: 73 W/mk Consistency: Liquid Viscosity: 0,0021 Pas Density: 6,24g/cm3 Recommended Temperature: 10 °C / +140 °C
• Model #:

• Model #: 166185688539

• Type: CPU Block
• Block Dim.: 70 x 70 x 32.5mm (L x W x H)
• Block Material: Copper
• Package Contents: 1x Alphacool Eisblock XPX Aurora Edge Full Brass, black 1x AMD mounting kit (backplate, screws, etc.) 1x Intel mounting kit (backplate, screws, etc.) 4x Rubber Caps 4x Screw Caps 4x Springs 4x 2mm Washers 4x 0,5 mm Washers 1x Digital-aRGB Adapter 1x Subzero 16 W/mk Thermal Grease + Spatula
• Model #: 4250197130820

• Volume / Net Weight: 50g
• Thermal Conductivity: 14.8W/mk
• Long Term Operating Temperature: -55 to 200 C
• Features: non-conducting
• Model #: DR-UTP-8-50G

• Volume / Net Weight: 3ml / 7.8g
• Thermal Conductivity: 11.8 W/mk
• Long Term Operating Temperature: -200 °C / +350 °C
• Specifications: The Hydronaut thermal grease delivers optimal heat transfer capabilities for larger-scale cooling solutions like water cooling systems. Hydronaut thermal grease consists of a silicon-free structure. The makes it very light and highly flexible and easy to apply. Hydronaut achieves best results if used on medium- to large-scale cooling solutions. This product is ROHS-compliant for demanding users.
• Model #: TG-H-030-R

• Type: CPU Block
• Block Dim.: 76.5 x 63.5 x 31mm (L x W x H)
• Block Material: Copper
• Package Contents: 1x Alphacool Eisblock XPX Pro Aurora - Full Brass, black 1x AMD mounting kit (backplates, screws, etc.) 1x Intel mounting kit (backplates, screws, etc.) 4x Knurled Nuts 4x Springs 4x 1mm Washers 1x Digital-aRGB Adapter 1x Subzero 16 W/mk thermal grease + spatula 1x Allen key
• Model #: 4250197130844

• Volume / Net Weight: 3.0g
• Thermal Conductivity: 16 w/mk
• Long Term Operating Temperature: -45 to 200 C
• Specifications: Thermal compound
• Model #: JP-DX1

Limited time offer, ends 01/31

• Compatibility: Motherboard Chipsets
• Features: These heatsinks have a layer of thermal adhesive that allow for easy installation on to your board. These heat sinks have profiles which are short enough to fit within standard Raspberry Pi cases. Pure copper heatsink thermal conductivity up to 401w / mk,good idear for processor,CPU and GPU cooling,Tested to fit the Raspberry Pi CPU / SoC,reduce the risk of hardware failure due to overheating. These heat sinks include adhesive thermal tape for efficient thermal transfer to the heat sink providing additional cooling to the IC. Also, it is easy to remove with a razor blade, so you can remove the heatsink without damaging the chips. These heat sinks can be used with other devices such as the Beaglebone to cool processor, regulators, etc. Installation Instructions: -Make sure the chip modules are free from dirt and gre...
• Model #: 11-001-098