Specifications: Bleed < 0.05% at 150 Degree C/24 Hours
Evaporation < 0.001% at 150 Degree C/24 Hours
Specific Gravity > 1.7 at Degree C
Thermal Conductivity > 1.93 W/m-K at 25 Degree C
Thermal Resistance < 0.120 Degree C-in2/W at 25 Degree C
Operating Temperature: -30 to 180 Degree C (-22 to 356 Degree F)
Color: Silver
Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20%
Product Length: 2.6 in [67 mm]
Product Weight: 0.4 oz [10 g]
Product Width: 0.8 in [20 mm]
Included in Package: 1 x 1.5g Tube of Silver Based Thermal Grease
Specifications: The thermal conductivity of CTG8D reaches 12.8W/mK, achieving above average performance on the market at a relatively moderate price. It can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the
Specifications: Renowned premium-grade thermal compound for optimal heat-transfer from the CPU or GPU to the heatsink; more than 150 awards and recommendations
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Part Number: Canned thermal paste has a unit price about 50% lower than syringe packaging, and is more recommended for large consumer groups such as physical stores, server fields, power battery fields, aerospace fields, etc.
Specifications: Applications: CPU / GPU Thermal Thermal Conductivity: 73 Wm / K Specific gravity: 6.24g/cm³ Viscosity: 00021 pas Operating temperature: 10 °C /140°C Content: 5g