Servers & Workstations

OUT OF STOCK

• Type: Tools and Hardware
• Parts: 2 years limited
• Labor: 2 years limited
• Model #: AR8400

OUT OF STOCK

• Type: Hardware Kit
• Specifications: Cage nuts with #10-32 thread for mounting equipment in enclosure for square mounting rails. Accommodates devices using #10-32 mounting screws. Includes: Qty 36 #10-32 caged nuts Standards: EIA-310-D Environmental Compliance: RoHS (Approximate): 0.37 lbs.
• Parts: 2 years limited
• Labor: 2 years limited
• Model #: AR8005

OUT OF STOCK

• Model #: SSG-631E-E1CR16H

OUT OF STOCK

• Type: Interface Module
• Specifications: Controller: ASPEED AST2500 Feature: Base Board Management Controller (IPMI2.0 with iKVM support) VGA (1920x1200@60Hz 32bpp) Memory: 2 SPI flash ROM 32MB 1 DDR4 SDRAM 4Gb Physical Status Form Factor: Low profile PCIe add-in-card Dimensions: 168.45 x 68.9 mm I/O Upstream interface: PCI Express2.0 x1 External: 1 RJ45 via Realtek RTL8211E for dedicated IPMI LAN (10/100/1000 Mbps), 1 DB-15 (VGA) Internal connectors: 2 SMBus header 1 x PMBus header 1 x IPMB header 1 x BMC reset 1 x BMC debug header 1 x V BIOS or system BIOS ROM 2 x BMC ROM 1 x Dual ROM select header 1 x TPM (13-pin, LPC) 1 x LPC header (13-pin) 2 x Fan header 1 x USB2.0 (5-pin): KVM and standby power 1 x header (18-pin): GPIO, NCSI 1 x header (18-pin): case open, system fail, GPIO, SMBus, PECI, voltage monitoring 1 x COM port (9-pin) 1 x micro-SD connector 1 x ...
• Model #: PAUL

OUT OF STOCK

• Rack Height: 4U
• Security: Cryptographically signed firmware Data at Rest Encryption (SEDs with local or external key mgmt) Secure Boot Secure Erase Secured Component Verification (Hardware integrity check) Silicon Root of Trust System Lockdown (requires iDRAC9 Enterprise or Datacenter) TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
• MAX Processors: 4
• Max Memory Capacity: 16TB
• Model #: PowerEdge_R960

OUT OF STOCK

• Model #: R152-P30 Rev. 100

OUT OF STOCK

• Workload: High Performance Simulation & Modeling, OLTP and All-Flash SDS
• Rack Height: 1U
• Security: Cryptographically signed firmware Secure Boot Secure Erase Silicon Root of Trust System Lockdown (requires iDRAC9 Enterprise or Datacenter) TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ Secured Component Verification (Hardware integrity check) Data at Rest Encryption (SEDs with local or external key mgmt)
• CPU Speed: 6526Y (2.80 GHz)
• Model #: ne_r660_tm_vi_vp_sb_os

OUT OF STOCK

• CPU Type: AMD EPYC 9004 Series
• Model #: R283-Z90-AAD2

OUT OF STOCK

• Brand: ASRock Rack
• Form Factor: 2U Rackmount
• Workload: Storage Server
• CPU Type: Supports AMD EPYC 7003 (with AMD 3D V-Cache Technology*)/7002 Series Processors *A BIOS update is required to support AMD EPYC 7003 series processors with AMD 3D V-Cache Technology
• Model #: 2U24E2S-ROME

OUT OF STOCK

• Model #: 4U8G-EGS2

OUT OF STOCK

• Model #: B8058T76X4-270TE4HR

OUT OF STOCK

• Workload: HPC, Dense VDI and Virtualization
• Rack Height: 1U
• Security: AMD Secure Encrypted Virtualization (SEV) AMD Secure Memory Encryption (SME) Cryptographically signed firmware Data at Rest Encryption (SEDs with local or external key mgmt) Secure Boot Secured Component Verification (Hardware integrity check) Secure Erase Silicon Root of Trust System Lockdown (requires iDRAC9 Enterprise or Datacenter) TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
• CPU Speed: 9124 (3.00 GHz)
• Model #: ne_r6625_vi_vp_sb_os

OUT OF STOCK

• CPU Type: Supports AMD EPYC 7003 (with AMD 3D V-Cache Technology*)/7002 Series Processors *A BIOS update is required to support AMD EPYC 7003 series processors with AMD 3D V-Cache Technology
• Memory Slots: 8 x 288Pin
• Max Memory Supported: Max. Capacity per DIMM: RDIMM: up to 64GB LRDIMM: up to 128GB RDIMM/LRDIMM-3DS: up to 256GB
• PCI Express: Rear: 1 FHHL PCIe4.0 x16 via RB1UX16_G4
• Model #: 1U8S2E-ROME/2T

OUT OF STOCK

• Workload: Virtualization, Hyper-Converged Infrastructure (HCI) and NFV
• Rack Height: 1U
• Security: AMD Secure Encrypted Virtualization (SEV) AMD Secure Memory Encryption (SME) Cryptographically signed firmware Data at Rest Encryption (SEDs with local or external key mgmt) Secure Boot Secure Erase Secured Component Verification (Hardware integrity check) Silicon Root of Trust System Lockdown (requires iDRAC9 Enterprise or Datacenter) TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
• CPU Speed: 9124 (3.00 GHz)
• Model #: ne_r6615_vi_vp_sb_os

OUT OF STOCK

• Model #: HGX 8x H200 GPU Server

OUT OF STOCK

• Brand: IBM
• Series: FlashSystem
• Form Factor: 1U Rackmount
• Workload: Storage Server
• Model #: FlashSystem 5300 All Flash 680TB

OUT OF STOCK

• Brand: IBM
• Series: FlashSystem
• Form Factor: 2U Rackmount
• Workload: Storage Server
• Model #: FlashSystem C200 All Flash 1.5PB

OUT OF STOCK

• CPU Type: Supports 2nd Gen. Intel Xeon Scalable Processors / Intel Xeon Scalable Processors
• Memory Slots: 24 x 288Pin
• SAS: Front Side Backplane: three 8-port 12Gbps* passive backplane Rear Side Bakplane: 2-port 12Gbps* and 2-port PCIe3.0 backplane * SAS drive is only supported with additional RAID/HBA cards
• PCI Express: SLOT2: PCIe3.0 x16 [CPU1] SLOT1: PCIe3.0 x16 [CPU0]
• Model #: RM23724-C622LM/22E

OUT OF STOCK

• Brand: IBM
• Series: FlashSystem
• Form Factor: 2U Rackmount
• Workload: Storage Server
• Model #: FlashSystem 7300 All Flash 1.5PB

OUT OF STOCK

• Rack Height: 1U
• Security: Cryptographically signed firmware Data at Rest Encryption (SEDs with local or external key mgmt) Secure Boot Secure Erase Secured Component Verification (Hardware integrity check) Silicon Root of Trust System Lockdown (requires iDRAC9 Enterprise or Datacenter) TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
• MAX Processors: 2
• Chipset: Intel C741
• Model #: PowerEdge_R660xs

OUT OF STOCK

• CPU Type: Supports AMD EPYC 9004 (with AMD 3D V-Cache Technology) and 97x4 series processors
• Memory Slots: 8 x 288Pin
• Max Memory Supported: Max. Capacity per DIMM - RDIMM: 96GB (2R) - RDIMM-3DS: 512GB (2S8Rx4)
• GPU/VPU: Aspeed AST2600
• Model #: 1U4L4E-GENOA/2T

OUT OF STOCK

• Rack Height: 1U
• Security: Cryptographically signed firmware Data at Rest Encryption (SEDs with local or external key mgmt) Secure Boot Secure Erase Secured-core server Secured Component Verification (Hardware integrity check) Silicon Root of Trust System Lockdown (requires iDRAC9 Enterprise or Datacenter) TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
• MAX Processors: 1
• Chipset: Intel C262
• Model #: PowerEdge_R360

OUT OF STOCK

• Rack Height: 4U
• LEDs: (1) HDD / (1) ID / (1) System Event / (2) LAN activity
• Max Memory Capacity: 8TB
• Expansion Slots: (3) PCIe Gen.4 x16 slots (FH/HL) / (10) PCIe Gen.4 x16 slots (FH/10.5"L/DW) (1) PCIe Gen.4 x16 OCP 3.0 slot for mezz. w/ pull tab
• Model #: B7129F83AV8E4HR-N-8H100

OUT OF STOCK

• CPU Type: 4th/5th Gen Intel Xeon Scalable
• Memory Slots: 8 x 288Pin
• Max Memory Supported: Max. Capacity per DIMM - RDIMM: 96GB - RDIMM-3DS: 256GB
• Serial ATA: 4-ports NVMe/SATA/SAS* passive backplane, 4-ports SATA passive backplane
• Model #: 1U4L4E-EGS/2T

OUT OF STOCK

• CPU Type: Supports 3rd Gen Intel Xeon Scalable Processors
• Memory Slots: 32 x 288Pin
• Max Memory Supported: Max. Capacity per DIMM - RDIMM: up to 64GB - RDIMM-3DS: up to 256GB - LRDIMM: up to 128GB - LRDIMM-3DS: up to 256GB
• GPU/VPU: Aspeed AST2500
• Model #: 2U2E-F/ICX2

OUT OF STOCK

• Type: PCIE X8 Mezzanine card
• Specifications: Interface: 10G/1G/100M/s LAN Controller: 1 x Intel X540 LAN Connector: 2 x RJ45 (10G Base-T) Compatible List: Motherboard / Barebone E3C224D4HM E3C224D4HM-8R E3C224D4M-16RE EP2C602D16FM 3U8G-C612 3U8G-C602 4U60L
• Model #: M540

OUT OF STOCK

• Brand: ASRock Rack
• Form Factor: 1U Rackmount
• Workload: General Purpose Server
• CPU Type: AMD EPYC 9005 & 9004 Series
• Model #: 1U12E-TURIN2

OUT OF STOCK

• Workload: Workstation
• CPU Type: AMD Ryzen 7000 Series
• Installed CPU: No CPU Installed
• Max Processors: 1
• Model #: W332-Z00

OUT OF STOCK

• Workload: AI/ML/HPC
• CPU Type: AMD Ryzen 5000 Series
• Model #: 1U2N2G-B550

OUT OF STOCK

• Workload: Workstation
• CPU Type: AMD Ryzen 7000 Series
• Model #: AS-3015A-I

OUT OF STOCK

• Brand: ASRock Rack
• Form Factor: 1U Rackmount
• Workload: General Purpose Server
• CPU Type: AMD EPYC 9005 & 9004 Series
• Model #: 1U12E-TURIN2/EVAC

OUT OF STOCK

• CPU Type: AMD EPYC 9004 Series
• Memory Slots: 24 x 288Pin
• Installed Memory Size: No Memory Installed
• Max Memory Supported: Up to 6TB: 24 x 256 GB DRAM
• Model #: AS -8125GS-TNHR

OUT OF STOCK

• Brand: IBM
• Series: FlashSystem
• Form Factor: 4U Rackmount
• Workload: Storage Server
• Model #: FlashSystem 9500 All Flash 365TB

OUT OF STOCK

• Model #: 1U4L-EGS/2T

OUT OF STOCK

• Model #: 1U12E-GENOA/EVAC

OUT OF STOCK

• Type: Interface Module
• Color: Green
• Specifications: Physical Status Dimensions: 2.90" x 5.70" (73.65 mm x 144.78 mm) Type: PCB material: NPG-170D+H1 I/O Upstream interface: PCIe4.0 x16 Internal connectors: 4 M.2 M-key (PCIe4.0 x4); support 22110/2280/2260/2242 form factors
• Model #: RB4M2_G4