Specifications: RoHS Compliance: Yes
Standard Drive Bays:
1 x 3.5" Hotswap
1 x 5.25" Drives
Hotswap HDD Type: 2.5" & 3.5" SAS I/II/III & SATA I/II/III
Indicators: Power and HDD activity
Material of Handle: Aluminum
Material of Main Chassis: Aluminum Design
Cooling Fan: 1 x 80mm
Dimensions: 1.65" x 5.75" x 7.32"
Specifications: RoHS Compliance: Yes
Standard Drive Bays:
1 x 3.5" Hotswap
1 x 5.25" Drives
Hotswap HDD Type: 2.5" & 3.5" SAS I/II/III & SATA I/II/III
Indicators: Power and HDD activity
Material of Handle: Aluminum
Material of Main Chassis: Aluminum Design
Cooling Fan: 1 x 80mm
Dimensions: 1.65" x 5.75" x 7.32"
Specifications: CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds.
Net Weight: 3g
Thermal Conductivity: 3.8 W/mK
Thermal Impedance: 0.01°C -in2/W
Viscosity: 2300K cPs
Specific Gravity: 2.5g/cm3
Specifications: RoHS Compliance: Yes
Standard Drive Bays:
1 x 3.5" Hotswap
1 x 5.25" Drives
Hotswap HDD Type: 2.5" & 3.5" SAS I/II/III & SATA I/II/III
Indicators: Power and HDD activity
Material of Handle: Aluminum
Material of Main Chassis: Aluminum Design
Cooling Fan: 1 x 80mm
Dimensions: 1.65" x 5.75" x 7.32"
Specifications: Standard Drive Bays
5.25" Drives: 1
Hotswap 3.5": 1
Hotswap 2.5": 1
Indicators Power On: solid blue/ HDD Access: amber
Security: Key Lock
Front Connector: 2x USB 3.0
Dimension: 7.44" x 5.83" x 1.65"
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, with good viscosity optimization. Single point/nine