Specifications: CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds.
Net Weight: 3g
Thermal Conductivity: 3.8 W/mK
Thermal Impedance: 0.01°C -in2/W
Viscosity: 2300K cPs
Specific Gravity: 2.5g/cm3
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, with good viscosity optimization. Single point/nine
Long Term Operating Temperature: -250 °C / +150 °C
Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive.
Carbonaut is available pre-assembled in many standard CPU / GPU sizes.
Size - CPU/GPU
32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K
38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X
51 x...
Specifications: Applications: CPU / GPU Thermal Thermal Conductivity: 73 Wm / K Specific gravity: 6.24g/cm³ Viscosity: 00021 pas Operating temperature: 10 °C /140°C Content: 5g
Specifications: Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus guaranteeing remarkable heat transfer.