Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Specifications: CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds.
Net Weight: 3g
Thermal Conductivity: 3.8 W/mK
Thermal Impedance: 0.01°C -in2/W
Viscosity: 2300K cPs
Specific Gravity: 2.5g/cm3
Specifications: The thermal conductivity of CTG10 thermal paste reaches 14.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the risk of short circuit, and can be easily extended into
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, with good viscosity optimization. Single point/nine
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