Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Specifications: Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus guaranteeing remarkable heat transfer.
Long Term Operating Temperature: -100 °C to +250 °C
Features: Description: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity.
Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is
Long Term Operating Temperature: -150 °C / +200 °C
Specifications: Even though the amount of metallic elements in Aeronauts formula is lower in comparison to our other products, it still provides reliable and perfomant thermal conductivity.
In our lab tests, Aeronaut showed a high amount of wear resistance under high temperatures, and acts also surface-protecting. The removal of Aeronaut thermal grease causes far less micro scratches on the components surface compared to other products.
Long Term Operating Temperature: -250 °C / +150 °C
Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive.
Carbonaut is available pre-assembled in many standard CPU / GPU sizes.
Size - CPU/GPU
32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K
38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X
51 x...
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.7g/cm3
Volume / Net Weight: 1.5 ml in Syringe (Grease Cleaner is / are NOT Included)
Thermal Conductivity: 9.0 W/mK
Specifications: Specific Gravity: 2.6 (g/cm3) (25°C)
Color: Gray
Improves heat transfer from chipset to cooler base or heatpipes
Precise and Even
Easy to spread and remove without surface damage
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 15~27(wt%)
Oil 11~19(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 250000Cps (Viscosity)
Thermal Conductivity: 10.2 W/m - Degree C
Thermal Impedance (Resistance): 0.015 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.5g/cm3
Long Term Operating Temperature: -250 °C / +150 °C
Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive.
Carbonaut is available pre-assembled in many standard CPU / GPU sizes.
Size - CPU/GPU
32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K
38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X
51 x...
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, and the viscosity is optimized to
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.