Specifications: Applications: CPU / GPU Thermal Thermal Conductivity: 73 Wm / K Specific gravity: 6.24g/cm³ Viscosity: 00021 pas Operating temperature: 10 °C /140°C Content: 5g
Specifications: The thermal conductivity of CTG8D reaches 12.8W/mK, achieving above average performance on the market at a relatively moderate price. It can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: The thermal conductivity of CTG10 thermal paste reaches 14.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the risk of short circuit, and can be easily extended into
Volume / Net Weight: 1.5 ml in Syringe (Grease Cleaner is / are NOT Included)
Thermal Conductivity: 9.0 W/mK
Specifications: Specific Gravity: 2.6 (g/cm3) (25°C)
Color: Gray
Improves heat transfer from chipset to cooler base or heatpipes
Precise and Even
Easy to spread and remove without surface damage
Part Number: Canned thermal paste has a unit price about 50% lower than syringe packaging, and is more recommended for large consumer groups such as physical stores, server fields, power battery fields, aerospace fields, etc.
Specifications: GEL canned thermal paste can be purchased at an extremely low price with a net content of 50g and a thermal conductivity coefficient of 10.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards.