Specifications: Thermal Conductivity (W/mk): 8.5
Viscosity (poise): 870
Density (g/cm3): 2.5
Net Weight: 4g
The ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU / GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer. The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low thermal resistance. These characteristics effectively dissipate the emitted heat from the core components. The consistency of the ARCTIC MX-4 is designed for simple application. Its text...
Specifications: Applications: CPU / GPU Thermal Thermal Conductivity: 73 Wm / K Specific gravity: 6.24g/cm³ Viscosity: 00021 pas Operating temperature: 10 °C /140°C Content: 5g
Features: EXCELLENT THERMAL CONDUCTIVITY:Thermal conductivity 1.93 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
HIGH DURABILITY: Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30℃-280℃ environment. High heat dissipation performance, high-cost
Long Term Operating Temperature: -150 °C / +200 °C
Specifications: Even though the amount of metallic elements in Aeronauts formula is lower in comparison to our other products, it still provides reliable and perfomant thermal conductivity.
In our lab tests, Aeronaut showed a high amount of wear resistance under high temperatures, and acts also surface-protecting. The removal of Aeronaut thermal grease causes far less micro scratches on the components surface compared to other products.
Specifications: Bleed < 0.05% at 150 Degree C/24 Hours
Evaporation < 0.001% at 150 Degree C/24 Hours
Specific Gravity > 1.7 at Degree C
Thermal Conductivity > 1.93 W/m-K at 25 Degree C
Thermal Resistance < 0.120 Degree C-in2/W at 25 Degree C
Operating Temperature: -30 to 180 Degree C (-22 to 356 Degree F)
Color: Silver
Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20%
Product Length: 2.6 in [67 mm]
Product Weight: 0.4 oz [10 g]
Product Width: 0.8 in [20 mm]
Included in Package: 1 x 1.5g Tube of Silver Based Thermal Grease
Specifications: GEL canned thermal paste can be purchased at an extremely low price with a net content of 50g and a thermal conductivity coefficient of 10.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards.
Specifications: Average Particle Size: 0.36 microns <0.000015 inch (70 particles lined up in a row equal 1/1000th of an inch.)
Temperature Limits: Peak: 150 C to >185 C
Long-Term: 150 C to 130 C
Coverage Area: 2.7gram syringe (Approximately 1cc).
At a layer 0.003" thick, one tube will cover about 22 square inches.
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ℃,. Its non-conductive properties eliminate the risk of short circuits, with good viscosity optimization. Single point/nine
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: Average Particle Size: <0.36 microns <0.000015 inch (70 particles lined up in a row equal 1/1000th of an inch.)
Temperature limits: Peak: -150 Degrees C to >185 Degrees C Long-Term: -150 Degrees C to 130 Degrees C
Coverage Area: 25-gram syringes. (Approximately 9.2cc) At a layer 0.003" thick, one tube will cover about 200 square inches.
Important Reminder:
Due to the unique shapes and sizes of the particles in Ceramique 2, it will take a minimum of 25 hours and several thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode...