Features: EXCELLENT THERMAL CONDUCTIVITY:Thermal conductivity 1.93 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
HIGH DURABILITY: Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30℃-280℃ environment. High heat dissipation performance, high-cost
Long Term Operating Temperature: -100 °C to +250 °C
Features: Description: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity.
Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is
Specifications: Bleed < 0.05% at 150 Degree C/24 Hours
Evaporation < 0.001% at 150 Degree C/24 Hours
Specific Gravity > 1.7 at Degree C
Thermal Conductivity > 1.93 W/m-K at 25 Degree C
Thermal Resistance < 0.120 Degree C-in2/W at 25 Degree C
Operating Temperature: -30 to 180 Degree C (-22 to 356 Degree F)
Color: Silver
Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20%
Product Length: 2.6 in [67 mm]
Product Weight: 0.4 oz [10 g]
Product Width: 0.8 in [20 mm]
Included in Package: 1 x 1.5g Tube of Silver Based Thermal Grease
Features: GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.7g/cm3
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 15~27(wt%)
Oil 11~19(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 250000Cps
Thermal Conductivity: 10.2 W/m - Degree C
Thermal Impedance (Resistance): 0.015 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.5g/cm3